Staff Equipment Development Engineer, Advanced Packaging

Job overview

The Staff Equipment Development Engineer role is onsite in Boise, ID; compensation is not specified. The position supports Micron’s Advanced Technology Packaging Development team within Technology Development. The engineer develops and optimizes first-of-a-kind wafer and die equipment from concept through implementation. Equipment roadmaps, failure analysis, and collaboration with process development, manufacturing, and vendors help advance robust next-generation semiconductor processes.

What you'll do

• Develop strategies to improve first-of-a-kind hardware maturity and create long-range roadmaps for post-probe wafer and die processing equipment. Optimize equipment for cost, availability, and capability
• collaborate with process development on new solutions
• conduct root-cause and failure-mode analysis
• lead development projects with original equipment manufacturer vendors
• conduct fundamental research
• and support equipment transfer to production facilities. Some domestic or international travel may be required.

What we're looking for

Skills & competencies

equipment development

advanced packaging

staff engineer

wafer equipment

die processing

first-of-a-kind hardware

failure analysis

equipment roadmaps

semiconductor manufacturing

boise id

micron

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plan options, income-protection benefits, paid family leave, paid time off, and paid holidays.

Why this role

Develops first-of-a-kind equipment and long-range roadmaps for advanced packaging; some travel may be required.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.