Yield Enhancement Physical Failure Analysis Engineer Intern

Job overview

The Yield Enhancement Physical Failure Analysis Engineer Intern role is onsite in Boise, ID; compensation is not specified. The intern supports Micron's Yield Enhancement team in investigating defect issues identified by the team and fab customers. The intern prepares and analyzes samples to locate physical defects in advanced memory devices, uses related electrical and yield data to guide investigations, and communicates findings to engineering partners. A focused improvement project during the three-month internship contributes to team and department objectives.

What you'll do

• Prepare and analyze PFA samples using methods such as deprocessing, cross-sectioning, FIB, and SEM/TEM imaging
• review EFA, fault isolation, probe, and yield data
• identify and categorize defect signatures
• analyze data to support root-cause investigations
• report findings
• learn lab equipment operation and complete required safety training
• complete and present a focused internship project.

What we're looking for

Skills & competencies

intern

yield enhancement

physical failure analysis

pfa

semiconductor devices

fib

sem/tem

root cause analysis

lab equipment

boise id

micron technology

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental and vision plans
• income protection benefits
• paid family leave
• paid time off
• paid holidays.

Why this role

Three-month full-time internship on day shift, Monday–Friday. No prior industry experience is required; candidates must be pursuing a bachelor's or master's degree in a related field.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology). Sector: 54.