Principal Engineer, Package Silicon Integration

Job overview

The Principal Engineer, Package Silicon Integration is an onsite role based in Boise, ID. Compensation is not specified for this position, which drives silicon and package integration strategies within Micron's Package Development Engineering team. This role develops technical roadmaps, defines design guidelines, and establishes approaches to monitor integration health across the product lifecycle. The engineer collaborates with multi-functional teams to deliver innovative products and uses AI-enabled tools to enhance productivity and data-driven decision-making.

What we're looking for

Skills & competencies

full-time

day shift

boise id

micron

semiconductor

package engineering

silicon integration

reliability

manufacturing

onsite

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plans, paid family leave, paid time-off, and paid holidays.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.