Director of Package Design Engineering

Job overview

The Director of Package Design Engineering role is full-time and onsite in Phoenix, AZ; compensation is not specified. Renesas develops semiconductor solutions for automotive, industrial, infrastructure, and Internet of Things applications. The role leads package technology development and qualification for power packaging needs, supporting product readiness and customer adoption. It coordinates research and development, subcontractor and contract-manufacturer work, process controls, production transitions, and package design rules to advance the company’s packaging roadmap.

What you'll do

• Lead package technology development, new-product introduction, research and development, global outsourced semiconductor assembly and test management, roadmap definition, budget management, and customer adoption programs. Develop and qualify package and interconnect methods
• select materials and assembly partners
• run design of experiments to optimize processes
• resolve integration issues
• establish production controls
• support production ramp-up
• address customer complaints
• and maintain package design rules.

What we're looking for

Skills & competencies

package design engineering

engineering director

semiconductor packaging

power modules

power devices

package qualification

process development

research and development

production ramp-up

phoenix az

renesas electronics

Work arrangement

• Weekend coverage required

Benefits & perks

• Renesas states that it offers a competitive benefits package
• details are provided during the hiring process.

Why this role

Focuses on power semiconductor packaging, including smart and vertical power stages, power modules, discrete FET packages, and wide-bandgap development.

About the employer

Renesas Electronics is hiring for this role. Industry: Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology). Sector: 54.