Staff Equipment Development Engineer - Advanced Packaging

Job overview

The Staff Equipment Development Engineer - Advanced Packaging is an onsite role based in Boise, ID. Compensation is not specified for this position. This role is part of the Advanced Technology Packaging Development (APTD) team. This role exists to develop and optimize next-generation wafer and die equipment. It contributes to the team by identifying and resolving equipment-related problems, coordinating equipment evaluations, and influencing technology roadmaps.

What you'll do

• Develop strategies and implement to improve Equipment maturity for (FOAK) hardware.
• Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing.
• Optimizing equipment to reduce cost, increase availability, and improve hardware and process capability.
• Collaborating with process development teams to develop innovative new solutions.
• Conducting root cause and failure mode analysis.
• Performing fundamental research to drive innovative solutions.
• Support equipment transfer to production facilities.

What we're looking for

Education

Master's Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields

Experience

2+ years of semiconductor process or equipment engineering experience

Skills & competencies

full-time

day shift

boise id

micron

equipment

advanced packaging

semiconductor

engineering

manufacturing

no weekends

no on-call

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.