Staff Process Engineer, APTD Bonding
Employment type
Full-time
Work setting
On-site
Location
Boise, ID
Schedule
Day shift
Posted
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Job overview
The Staff Process Engineer, APTD Bonding is an onsite role based in Boise, ID. Compensation is not specified for this position, which supports the Advanced Packaging Technology Development (APTD) department. This role exists to start up, develop, and optimize processes to improve product quality and reliability. The engineer will resolve manufacturing line problems and drive process yield and productivity improvements.
What you'll do
- Develop new or modified process formulations.
- Identify and resolve assembly process-related problems.
- Coordinate process and material evaluation initiatives.
- Validate and fan out new process baselines.
What we're looking for
- Skills & competencies
- full-timeday shiftboise idmicronsemiconductorprocess engineerpackagingbondingr&donsiteno on-callno travel
- Work arrangement
- Weekend coverage required
Benefits & perks
- Medical, dental, and vision plans, income protection, paid family leave, and robust paid time-off.
Why this role
Requires 5 years of relevant industry experience and knowledge of advanced package integration.
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Automatic Environmental Control Manufacturing for Residential, Commercial, and Appliance Use. Sector: 33.
Additional details
- Industry sector
- 33
- Industry
- Automatic Environmental Control Manufacturing for Residential, Commercial, and Appliance Use
- Occupation code
- 17-2131.00
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Listing ID: ef28564c-0b15-4a91-b292-83ff179ed2a4