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Staff HBM Product Yield Enhancement Failure Analysis Engineer

Micron Technology, Inc. · Boise, ID

Employment type

Full-time

Work setting

On-site

Location

Boise, ID

Schedule

Day shift

Posted

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Job overview

The Staff HBM Product Yield Enhancement Failure Analysis Engineer is an onsite role based in Boise, ID. Compensation is not specified for this position, which focuses on product reliability and component failure analysis for next-generation HBM devices. This role uses electrical and physical characterization techniques combined with statistical analysis to identify failures introduced by fabrication and assembly processes. The engineer coordinates improvement activities with product, process, and test engineering teams to enable rapid production ramp.

What we're looking for

Skills & competencies
full-time
day shift
boise id
micron
semiconductor
hbm
failure analysis
yield enhancement
engineering
onsite
Work arrangement
  • Weekend coverage required

Benefits & perks

  • Medical, dental, and vision plans, paid family leave, paid time-off, and paid holidays.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Testing Laboratories and Services. Sector: 54.

Additional details

Industry sector
54
Industry
Testing Laboratories and Services
Occupation code
17-2071.00
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