Senior Package Design Engineer

Job overview

The Senior Package Design Engineer is an onsite role based in Boise, ID. Compensation is not specified for this position, which involves developing advanced semiconductor packaging solutions for memory products. This role exists to lead co-design activities that bridge silicon design, package architecture, and product development. The engineer will collaborate with global teams to deliver high-performance, reliable, and manufacturable package designs for various applications.

What you'll do

• Lead co-design activities for new product concepts.
• Define and optimize package architectures.
• Lead package layout activities.
• Partner with SI/PI teams for simulation analysis.
• Collaborate with OSAT partners for HVM delivery.

What we're looking for

Skills & competencies

full-time

day shift

boise id

micron

package design

semiconductor

dram

nand

eda

onsite

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plans, paid family leave, paid time-off, and paid holidays.

Why this role

Requires 5-10+ years of experience in advanced memory substrate design and EDA tools.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.