Package Layout Design Engineer, Annapurna Labs

Job overview

The Package Layout Design Engineer role is an onsite position based in Tempe, AZ. The base salary range is $136,000.00 - $184,000.00 USD annually, and this role supports the Annapurna Labs team in developing machine learning acceleration hardware. This role exists to contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs. The engineer executes package layout tasks from floor planning through tape out.

What you'll do

• Execute package layout tasks
• Implement physical designs for advanced packaging architectures
• Support package floorplan development
• Perform RDL and substrate routing
• Support die-level RDL routing.

What we're looking for

Skills & competencies

full-time

day shift

tempe az

annapurna labs

package layout

physical design

asic

machine learning

hardware

$136k-$184k/yr

Work arrangement

• Weekend coverage required

Benefits & perks

• Health insurance, 401(k) matching, paid time off, parental leave, sign-on payments, RSUs

Why this role

Requires 5+ years of experience in IC package layout and physical design.

About the employer

Annapurna Labs (U.S.) Inc. is hiring for this role. Industry: Industrial Design Services. Sector: 54.