Staff Engineer, APTD Dry Etch

Job overview

The Staff Engineer, APTD Dry Etch is an onsite role based in Boise, ID. Compensation is not specified for this position. The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. This role exists to develop and scale plasma-based etch processes for next-generation packaging technologies. The engineer will influence long-term technology roadmaps and collaborate across global R&D and manufacturing teams to turn breakthrough ideas into production-ready solutions.

What you'll do

• Develop and optimize dry etch process modules
• drive process capability and cost improvements
• collaborate with process integration and adjacent teams
• perform root-cause analysis
• support global process transfer.

What we're looking for

Education

Bachelor's degree in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemistry, Semiconductor Engineering, or related field.

Experience

5+ years of relevant dry etch experience with a Bachelor's degree, or 3+ years with a Master's/PhD.

Skills & competencies

full-time

day shift

boise id

micron

dry etch

semiconductor

r&d

engineering

no weekends

no on-call

visa sponsorship not specified

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology). Sector: 54.