Senior Manager, Package Design Engineering

Job overview

The Senior Manager, Package Design Engineering role is onsite in Tempe, AZ. Compensation is not specified. Renesas develops embedded semiconductor solutions for automotive, industrial, infrastructure, and IoT applications. The manager leads package technology development and new product introduction for power products, coordinating internal teams and global manufacturing partners. The role advances package designs from development and qualification into production while addressing quality, reliability, delivery, and customer requirements.

What you'll do

• Lead package technology development and new product introduction
• manage package and interconnect design for AI and data-center power products
• support SiC and GaN package development and advanced packaging technologies
• evaluate and qualify materials, processes, and assembly partners
• coordinate design experiments, process optimization, and qualification
• resolve integration issues
• establish production controls and corrective actions
• manage technology transfer, ramp-up, yield improvement, and package design standards.

What we're looking for

Skills & competencies

package design engineering

semiconductor packaging

power modules

new product introduction

sic

gan

flip-chip

wafer-level packaging

renesas

tempe az

manufacturing partners

quality and reliability

Work arrangement

• Weekend coverage required

Benefits & perks

• Competitive benefits package
• further details are provided during the hiring process.

Why this role

Focuses on power semiconductor packaging, including power modules, wafer-level packaging, flip-chip, SiC/GaN, and advanced substrates.

About the employer

Renesas is hiring for this role. Industry: Other Electronic Component Manufacturing. Sector: 33.