Lead Packaging Systems Engineer, Paper and General Industrial

Job overview

The Lead Packaging Systems Engineer, Paper and General Industrial role is based in Cincinnati, Ohio, with flexible work-from-home options available. The listed base salary range is $90,000–$140,000 per year. The role supports Foth’s engineering consulting work for client projects. The engineer leads mechanical design for converting and packaging systems projects, helping deliver capital projects within defined scope, cost, and schedule. The position develops design packages and coordinates with clients, vendors, and project teams to support installation and system startup.

What you'll do

• Lead mechanical design for converting and packaging line projects
• develop concepts, proposals, layouts, equipment specifications, and detailed design packages
• delegate design work and perform quality reviews
• interface with clients and vendors
• review equipment bids
• lead design reviews
• provide startup support and troubleshooting
• travel to offices or client locations as required, anticipated at 25–35% annually
• coach and mentor engineers and designers.

What we're looking for

Skills & competencies

lead packaging systems engineer

paper converting

packaging systems

mechanical design

capital projects

equipment specification

client interface

cincinnati oh

flexible work from home

25–35% travel

$90,000–$140,000 per year

Work arrangement

• Weekend coverage required

Benefits & perks

• Eligible employees may receive medical, dental, and vision insurance, an employee assistance program, disability coverage, retirement benefits, holiday pay, voluntary benefits, and paid time off for regular full-time members.
• Bonus programs may also be available.

Why this role

The role combines systems design leadership with client-facing project delivery and regular travel to client locations.

About the employer

The Foth Companies is hiring for this role. Industry: Engineering Services. Sector: 54.