Packaging Module Development Engineer

INTEL

FULL_TIME

Salary

$0 - $0 per yearly

Location(s)

  • Phoenix AZ US

Description

Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies. This role involves working in close collaboration with packaging assembly module teams, package architecture, integration, and assembly, substrate, an optical component materials supply

Tags

  • Software Development

How to apply

Apply for this job at: https://api.collabwork.com/api:1SHNakFf/xmljobs?ref=ZDE1OTg5Y2JhYjIyNDJkYjhjOWU2Yzc3ZjFlMTk0MWF8Y2QxMzUxYTctNGMyYi00YzczLThkM2MtMDI4NWNjYjBmZTgx&utm_source=collabworkv3site