Product Pathfinding Engineer, High Bandwidth Memory

Job overview

The Product Pathfinding Engineer, High Bandwidth Memory role is onsite in Boise, ID; compensation is not specified. Micron develops memory solutions and HBM products for machine learning and artificial intelligence applications. This engineer develops next-generation HBM and near-memory DRAM solutions, including electrical and packaging approaches for 2.5D and 3D integration. The role connects research and development, manufacturing, marketing, and quality teams to resolve silicon findings, prepare builds, and deliver products aligned with technical and business objectives.

What you'll do

• Develop long-range HBM or alternative near-memory DRAM solutions
• contribute to 2.5D and 3D electrical and packaging solutions
• collaborate with customers and internal teams on requirements and product development
• ensure silicon findings are resolved
• improve build readiness and align strategies with product objectives and timelines.

What we're looking for

Skills & competencies

product pathfinding engineer

hbm

high bandwidth memory

dram

semiconductor

2.5d integration

3d integration

product development

supplier and customer collaboration

boise id

micron technology

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental and vision plans
• income protection benefits
• paid family leave
• paid time off
• paid holidays.

Why this role

Requires a strong Electrical or Computer Engineering foundation and industry experience in high-speed datapath design, logic development, and advanced circuit analysis. Preferred qualifications include DRAM knowledge and technical leadership.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.