Staff Process Engineer, Advanced Packaging CMP

Job overview

The Staff Process Engineer, Advanced Packaging CMP role is onsite in Boise, ID; compensation is not specified. The position is part of Micron’s Advanced Packaging Technology Development department, which develops processes and technologies for next-generation semiconductor products. The engineer develops and optimizes chemical mechanical planarization processes to improve product quality, reliability, yield, cost, and productivity. The role also investigates manufacturing problems and leads technical projects that advance process monitoring, control, and manufacturing readiness.

What you'll do

• Conduct research, consumables development, hardware evaluation, and process testing
• manage experiments to widen process margins and assess manufacturability
• incorporate manufacturing methods into early development
• design process monitoring and control methodologies
• advise on technical projects and lead complex cross-functional improvements
• contribute to innovation projects through patents or technical papers.

What we're looking for

Skills & competencies

boise id

staff process engineer

advanced packaging

cmp

chemical mechanical planarization

process development

yield improvement

failure analysis

spc

manufacturing optimization

micron technology

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plan choices
• income-protection programs
• paid family leave
• paid time off
• and paid holidays.

Why this role

Requires hands-on semiconductor CMP process development and equipment experience, including advanced packaging applications.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.