Process Integration Engineer, Advanced Packaging Technology Development

Job overview

The Process Integration Engineer role is onsite in Boise, ID; compensation is not specified. The position supports Micron’s Advanced Packaging Technology Development organization, which develops next-generation packaging and integration technologies for memory products. The engineer develops and integrates semiconductor process flows for wafer-level technology and reconstructed substrates. Through experiments, data analysis, and cross-functional technical projects, the role helps turn advanced packaging concepts into manufacturable, reliable solutions.

What you'll do

• Lead technical integration projects for new memory and advanced packaging technologies. Design and complete experiments to assess process performance, variability, reliability, and yield
• solve integration issues using inline, defect, parametric, probe, reliability, and package-level data. Partner with process development, device engineering, package design, product engineering, reliability, materials, and manufacturing teams to develop and qualify technologies. Apply AI tools to analysis, experiment planning, documentation, and technical problem-solving.

What we're looking for

Skills & competencies

process integration

advanced packaging

wafer-level technology

memory products

semiconductor process

experiment design

yield and reliability

data analysis

ai tools

boise id

micron

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plan options, income-protection benefits, paid family leave, paid time off, and paid holidays.

Why this role

Focuses on wafer-level technology and reconstructed-substrate flows for advanced memory packaging.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.