Package Architect
Compensation
$177k – $387k /yr
Employment type
Full-time
Work setting
On-site
Location
Boise, ID
Schedule
Day shift
Posted
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Job overview
The Package Architect is an onsite role based in Boise, ID, with a base salary range of $177,000.00 - $387,000.00 per year. This position supports the Advanced Packaging & System Exploration team. The role exists to define package concepts that enable future memory and system products. It contributes to the company's goals by building, modeling, and simulating advanced package concepts to influence roadmaps.
What you'll do
- Define and explore advanced package architectures
- Perform package-level trade-off studies
- Create hands-on package designs and models
- Run SI/PI and thermal simulations
- Define package requirements.
What we're looking for
- Education
- Bachelor's degree or equivalent practical experience in EE, ME, Materials, or related field
- Experience
- 10+ years of hands-on experience in package design or package-level simulation
- Skills & competencies
- full-timeday shiftboise idmicronpackage architectadvanced packagingengineeringsemiconductormodeling$177k-$387k/yronsite
- Work arrangement
- Weekend coverage required
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Automatic Environmental Control Manufacturing for Residential, Commercial, and Appliance Use. Sector: 33.
Additional details
- Industry sector
- 33
- Industry
- Automatic Environmental Control Manufacturing for Residential, Commercial, and Appliance Use
- Occupation code
- 15-1252.00
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Listing ID: c4bdad5d-920f-494d-8809-40aba4ef4f9e