Packaging Module Development Engineer
INTEL
FULL_TIME
Salary
$0 - $0 per yearly
Location(s)
- Phoenix AZ US
Description
This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, product
Tags
- Supply Chain
How to apply
Apply for this job at: https://api.collabwork.com/api:1SHNakFf/xmljobs?ref=YmJhOWVhZDhhMGY0NDdhYzhiNGE1OWI1MDg0MjRhNTd8Y2QxMzUxYTctNGMyYi00YzczLThkM2MtMDI4NWNjYjBmZTgx&utm_source=collabworkv3site