Process Integration Engineer, Advanced Packaging Technology Development (APTD)

Job overview

The Process Integration Engineer, APTD is an onsite role based in Boise, ID, with compensation not specified. This role supports the Technology Development (TD) department. This role exists to develop and enable the deployment of advanced interconnect technologies, ensuring products meet performance, cost, and manufacturability requirements.

What you'll do

• Collaborate with internal teams and suppliers to develop advanced packaging technologies
• deliver packaging solutions on schedule
• define project timelines and validation plans
• enable transitions to production
• define technology roadmaps.

What we're looking for

Education

MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field.

Experience

3+ years of professional experience in the semiconductor industry.

Skills & competencies

full-time

day shift

boise id

micron

process integration

advanced packaging

semiconductor

engineering

development

no weekends

no on-call

visa sponsorship available

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables. Sector: 33.