Packaging Module Development Engineer
INTEL
FULL_TIME
Salary
$0 - $0 per yearly
Location(s)
- Phoenix AZ US
Description
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a
Tags
- Software Development
How to apply
Apply for this job at: https://api.collabwork.com/api:1SHNakFf/xmljobs?ref=YTA5OGM3OWMwZjFjNDY3NjlhNzA2MzYzNjk5MTQxYWF8Y2QxMzUxYTctNGMyYi00YzczLThkM2MtMDI4NWNjYjBmZTgx&utm_source=collabworkv3site