Director / DMTS, Process Integration Lead, Advanced Packaging

Job overview

The Director / DMTS, Process Integration Lead, Advanced Packaging role is onsite in Boise, ID; compensation is not specified. The role supports Micron’s advanced packaging work on 2.5D, 3D, and heterogeneous integration technologies for next-generation AI and high-performance computing products. The lead manages a technical team developing and integrating packaging technologies from concept through manufacturing. The role drives process development, qualification, yield and reliability improvement, and technology transfer while shaping the roadmap for future packaging platforms.

What you'll do

• Manage and grow a team responsible for process integration across 2.5D and 3D packaging, advanced interconnects, die stacking, and HBM
• lead technology development, optimization, and qualification
• improve yield, reliability, and performance through characterization and data-driven investigation
• lead technology transfer to manufacturing
• collaborate across design, process, equipment, reliability, test, and manufacturing teams
• address wafer/die warpage.

What we're looking for

Skills & competencies

boise id

director

dmts

process integration lead

advanced packaging

2.5d

3d packaging

hbm

hybrid bonding

technology transfer

team leadership

micron technology

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plan choices
• income-protection programs
• paid family leave
• paid time off
• and paid holidays.

Why this role

Leads advanced packaging integration and technology transfer while mentoring a technical team and shaping next-generation packaging roadmaps.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.