High Bandwidth Memory Product & System Engineering Intern

Job overview

The High Bandwidth Memory Product & System Engineering Intern role is onsite in Boise, ID; compensation is not specified. Micron develops memory and storage solutions that support generative AI and high-performance computing. The intern helps validate and optimize HBM products by developing and improving validation software and hardware, configuring and characterizing lab systems, and assisting with hardware and software debugging. The work supports reliable integration of HBM into customer platforms.

What you'll do

• Develop and improve software and hardware to validate HBM in systems
• configure, maintain, and characterize HBM-based lab systems
• assist with hardware and software debugging
• communicate results
• learn HBM, DRAM, and memory systems.

What we're looking for

Skills & competencies

intern

high bandwidth memory

hbm

system engineering

memory systems

dram

python

c/c++

lab validation

boise id

micron technology

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental and vision plans
• income protection benefits
• paid family leave
• paid time off
• paid holidays.

Why this role

Internship requires current enrollment in a Bachelor's or Master's program in Electrical or Computer Engineering, with graduation after September 2027. Preferred experience includes Linux, Verilog/SystemVerilog, FPGA or microcontroller troubleshooting, and memory interfaces.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.