Staff / Principal Wafer Bond Process Development Engineer
Employment type
Full-time
Work setting
On-site
Location
Boise, ID
Schedule
Day shift
Posted
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Job overview
The Staff / Principal Wafer Bond Process Development Engineer is an onsite role based in Boise, ID. Compensation is not specified for this position, which supports Micron Technology's DRAM Technology Development group. This role focuses on developing and optimizing wafer bonding processes to enable next-generation memory technologies. The engineer plans experiments, drives yield improvements, and collaborates with cross-functional teams to ensure high-quality, reliable manufacturing processes.
What we're looking for
- Skills & competencies
- full-timeday shiftboise idmicronsemiconductorwafer bondingprocess engineerdraminnovationmanufacturing
- Work arrangement
- Weekend coverage required
Benefits & perks
- Health, savings, wellbeing programs, stock purchase discount, generous time off
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.
Additional details
- Industry sector
- 33
- Industry
- Semiconductor and Related Device Manufacturing
- Occupation code
- 17-2112.00
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Listing ID: 963fba99-8d69-431c-8a5a-ca7b05b4422b