Packaging Module Development Engineer

INTEL

FULL_TIME

Salary

$0 - $0 per yearly

Location(s)

  • Phoenix AZ US

Description

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of

Tags

  • Supply Chain
  • Cybersecurity

How to apply

Apply for this job at: https://api.collabwork.com/api:1SHNakFf/xmljobs?ref=OTRiNWZmMGY2ZWRhNGJiNDkyODA0ZjZhODM1OWYzOTB8Y2QxMzUxYTctNGMyYi00YzczLThkM2MtMDI4NWNjYjBmZTgx&utm_source=collabworkv3site