Director, Package Design Engineering - San Jose CA - Full-Time Day Shift
Compensation
$230k – $260k /yr
Employment type
Full-time
Work setting
On-site
Location
San Jose, CA
Schedule
Day shift
Posted
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Job overview
Compensation is $230,000–$260,000 per year. The Director, Package Design Engineering is an onsite position based in San Jose, CA. This role supports the Renesas Engineering department in advancing semiconductor packaging technology. The role exists to lead the development of package and interconnect methods for AI and datacenter infrastructure power needs. It contributes to the company's goal of making every endpoint intelligent by ensuring high-quality, reliable, and innovative packaging solutions for global electronics manufacturers.
What you'll do
- Lead package technology development and NPI
- manage global OSAT relationships
- define technology roadmaps
- oversee R&D budgets
- ensure production quality and reliability
- establish package design rules.
What we're looking for
- Skills & competencies
- full-timeday shiftsan jose carenesassemiconductorengineeringpackage designleadershiponsiteweekend required
- Work arrangement
- Weekend coverage required
Benefits & perks
- Competitive salary, bonus opportunities, comprehensive benefits package.
Why this role
Strategic leadership role in advanced power semiconductor packaging.
About the employer
Renesas is hiring for this role. Industry: Computer Systems Design Services. Sector: 54.
Additional details
- Industry sector
- 54
- Industry
- Computer Systems Design Services
- Occupation code
- 11-9041.00
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Listing ID: 921a93d7-47fc-431e-b75a-427e914e8526