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Principal DRAM Process Pathfinding Engineer, Dry Etch

Micron Technology, Inc. · Boise, ID · Semiconductor Process Engineering, Dry Etch

Employment type

Full-time

Work setting

On-site

Location

Boise, ID

Schedule

Day shift

Posted

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Job overview

The Principal DRAM Process Pathfinding Engineer, Dry Etch role is onsite in Boise, Idaho. Compensation is not specified. The role supports Micron's semiconductor process engineering team in advancing dry etch technologies for current and future technology nodes. The position leads dry etch process development and helps shape process and technology roadmaps. It applies deep plasma-etch expertise to resolve complex process, defect, and equipment challenges while guiding cross-functional work and mentoring engineers.

What you'll do

  • Lead development and optimization of dry etch processes
  • partner with process integration and engineering teams on integration flows, specifications, and roadmaps
  • lead cross-functional efforts to resolve structural, process, defect, and hardware challenges
  • present roadmaps and project impacts to leadership
  • mentor dry etch engineers and collaborate with equipment vendors.

What we're looking for

Skills & competencies
principal engineer
dram
dry etch
semiconductor process engineering
plasma etch
process development
technology roadmaps
defect resolution
cross-functional leadership
boise id
micron
Work arrangement
  • Weekend coverage required

Benefits & perks

  • Micron describes medical, dental, and vision plans, income-protection programs, paid family leave, paid time off, and paid holidays.

Why this role

Requires more than 10 years of applicable semiconductor process engineering experience and dry etch R&D experience; travel may be required for project-related purposes.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.

Additional details

Industry sector
54
Industry
Engineering Services
Occupation code
17-2112.00
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