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Senior Manager, Package Design Engineering

Renesas Electronics · Tempe, AZ · Package Design Engineering

Employment type

Full-time

Work setting

On-site

Location

Tempe, AZ

Schedule

Day shift

Posted

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Job overview

The Senior Manager, Package Design Engineering role is onsite in Tempe, AZ. Compensation is not specified. Renesas Electronics develops embedded semiconductor solutions for automotive, industrial, infrastructure, and Internet of Things applications. The manager leads package technology development and new product introduction, coordinating internal teams and global manufacturing partners to develop, qualify, and transfer package solutions into production. The role supports product quality, reliability, customer requirements, and execution of the company’s packaging technology roadmap.

What you'll do

  • Lead package technology development and NPI execution
  • coordinate OSAT partners on package development and qualification
  • manage package and interconnect design for power products
  • support SiC and GaN packaging, substrates, wafer-level packaging, flip-chip, and multi-chip modules
  • evaluate and qualify materials, processes, and manufacturing partners
  • plan design experiments and optimize assembly processes
  • coordinate cross-functional qualification work
  • resolve integration issues and assess risks
  • implement production controls and corrective actions
  • oversee technology transfer, ramp-up, yield improvement, and readiness reviews
  • lead customer corrective-action activities
  • maintain package design rules and engineering standards.

What we're looking for

Skills & competencies
senior manager
package design engineering
renesas electronics
tempe az
onsite
full-time
semiconductor packaging
power sip and modules
sic and gan
wafer-level packaging
flip-chip
npi execution
Work arrangement
  • Weekend coverage required

Benefits & perks

  • Competitive benefits package
  • further details are provided during the hiring process.

Why this role

Requires a bachelor’s or master’s degree in a relevant discipline and 12–15 years of semiconductor package development experience, including technical or project leadership. A doctorate is a plus.

About the employer

Renesas Electronics is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.

Additional details

Industry sector
33
Industry
Semiconductor and Related Device Manufacturing
Occupation code
11-9041.00
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