Intern - HBM SoC Physical Design Engineer
Compensation
$38.84 – $50.24 /yr
Employment type
Full-time
Work setting
On-site
Location
Folsom, CA
Schedule
Day shift
Posted
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Job overview
The Intern - HBM SoC Physical Design Engineer is an onsite role based in Folsom, CA. The salary range is $38.84 - $50.24 per hour. This role supports the HBM Physical Design team at Micron Technology, a world leader in memory and storage solutions. This position exists to support the implementation of advanced HBM SoC designs. The intern will gain hands-on experience with physical design methodologies, timing analysis, and automation while contributing to next-generation memory products.
What you'll do
- Support physical implementation of SoC design blocks.
- Analyze timing, power, and congestion.
- Assist with static timing analysis and timing closure.
- Develop automation tools and workflows.
- Collaborate with multi-functional teams.
What we're looking for
- Skills & competencies
- full-timeday shiftfolsom camicroninternshipphysical designsocsemiconductor$38-$50/hrengineering
- Work arrangement
- Weekend coverage required
Benefits & perks
- Choice of medical, dental, and vision plans, income protection programs, paid time-off, and paid holidays.
Why this role
Internship focused on physical design and SoC implementation.
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Computer Systems Design Services. Sector: 54.
Additional details
- Industry sector
- 54
- Industry
- Computer Systems Design Services
- Occupation code
- 17-2061.00
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Listing ID: 7f703095-ee0f-4f49-889b-8df2b32afa3f