Process Integration Intern, Advanced Packaging

Job overview

The Process Integration Intern, Advanced Packaging role is onsite in Boise, ID. Compensation is not specified. The intern supports Micron’s Wafer Level Packaging Technologies Team, which develops advanced interconnect and packaging solutions for next-generation memory technologies. Working alongside experienced engineers, the intern contributes to process development and optimization through structured problem-solving, experimental design, line monitoring, and data analysis. The work supports yield improvement and process integration for advanced packaging technologies.

What you'll do

• Lead problem-solving activities using structured methods such as Kepner-Tregoe
• define and implement Design of Experiments for process development
• communicate findings to local and global teams
• support line monitoring, project management, and yield improvement
• develop monitoring methods and critical metrics
• conduct and document experiments
• analyze results and provide recommendations
• use AI tools, workflows, and agents to support learning.

What we're looking for

Skills & competencies

process integration intern

advanced packaging

semiconductor

wafer level packaging

design of experiments

yield improvement

line monitoring

data analysis

boise id

micron technology

Work arrangement

• Weekend coverage required

Benefits & perks

• Micron describes medical, dental, and vision plans, income-protection programs, paid family leave, paid time off, and paid holidays.

Why this role

Applicants must be pursuing a bachelor's or master's degree with expected graduation no earlier than Fall 2027. Semiconductor process integration or packaging experience is preferred.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.