RDA Engineer, Advanced Packaging
Employment type
Full-time
Work setting
On-site
Location
Boise, ID
Schedule
Day shift
Posted
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Job overview
The RDA Engineer, Advanced Packaging is an onsite role based in Boise, ID. Compensation is not specified for this position, which supports the Advanced Packaging Technology Development department. This role exists to use defect detection equipment and processes to solve issues and drive continuous improvement. It contributes to the company's success by accelerating cycles of learning and technology transfer in Technology Development.
What you'll do
- Analyze experimental process flows for defect anomalies.
- Work with new inspection tools to drive earlier detection.
- Build and improve techniques for identifying process issues.
- Collaborate with the global network to develop best-known methods.
What we're looking for
- Education
- Bachelor's Degree in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, or related
- Experience
- 4-6 years of semiconductor industry experience, 3 years of RDA experience
- Skills & competencies
- full-timeday shiftboise idmicronrdaadvanced packagingdefect analysissemiconductorengineeringno on-callno weekendsvisa sponsorship not specified
- Work arrangement
- Weekend coverage required
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.
Additional details
- Industry sector
- 33
- Industry
- Semiconductor and Related Device Manufacturing
- Occupation code
- 17-2072.00
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Listing ID: 78ef255a-3e48-44fd-83da-1f9a4ce851f0