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MTS HBM Architecture & Circuit Design Engineer

Micron Technology, Inc. · Richardson, TX · HBM Core-Die Architecture & Circuit Design

Employment type

Full-time

Work setting

On-site

Location

Richardson, TX

Schedule

Day shift

Posted

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Job overview

The MTS HBM Architecture & Circuit Design Engineer role is onsite in Richardson, TX. Compensation is not specified. The engineer works at Micron Technology, a memory and storage solutions company developing products that support information technology and AI-enabled applications. The role defines next-generation high-bandwidth memory core-die architecture and DRAM circuit designs, balancing bandwidth, power, area, thermal performance, and reliability. It collaborates across design and verification teams and supports silicon bring-up and architecture handoff.

What you'll do

  • Own HBM core-die architecture, including bank and bank-group organization, array partitioning, datapath, refresh, and reliability features
  • drive DRAM circuit design and timing closure for row, column, sensing, and datapath paths
  • optimize bandwidth, power, area, thermal, and reliability trade-offs
  • define and validate refresh, row-hammer mitigation, data-retention, and power-efficient schemes
  • lead feasibility studies using transistor-level simulation and physical implementation analysis
  • develop HBM Architecture Reference Designs, schematics, timing budgets, and verification methodology
  • collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams
  • support silicon bring-up, characterization, failure analysis, and design handoff.

What we're looking for

Skills & competencies
mts hbm architecture & circuit design engineer
hbm
dram architecture
circuit design
richardson tx
micron technology
3d-stacked memory
spice simulation
timing closure
silicon bring-up
memory reliability
cross-functional design
medical dental vision
paid family leave
Work arrangement
  • Weekend coverage required

Benefits & perks

  • Medical, dental, and vision plans, income-protection benefits, paid family leave, paid time off, and paid holidays.

Why this role

Designs advanced 3D-stacked HBM core-die architecture and critical DRAM circuits.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.

Additional details

Industry sector
33
Industry
Semiconductor and Related Device Manufacturing
Occupation code
17-2072.00
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