MTS HBM Architecture & Circuit Design Engineer
Employment type
Full-time
Work setting
On-site
Location
Richardson, TX
Schedule
Day shift
Posted
You'll be redirected to the employer's application page.
Job overview
The MTS HBM Architecture & Circuit Design Engineer role is onsite in Richardson, TX. Compensation is not specified. The engineer works at Micron Technology, a memory and storage solutions company developing products that support information technology and AI-enabled applications. The role defines next-generation high-bandwidth memory core-die architecture and DRAM circuit designs, balancing bandwidth, power, area, thermal performance, and reliability. It collaborates across design and verification teams and supports silicon bring-up and architecture handoff.
What you'll do
- Own HBM core-die architecture, including bank and bank-group organization, array partitioning, datapath, refresh, and reliability features
- drive DRAM circuit design and timing closure for row, column, sensing, and datapath paths
- optimize bandwidth, power, area, thermal, and reliability trade-offs
- define and validate refresh, row-hammer mitigation, data-retention, and power-efficient schemes
- lead feasibility studies using transistor-level simulation and physical implementation analysis
- develop HBM Architecture Reference Designs, schematics, timing budgets, and verification methodology
- collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams
- support silicon bring-up, characterization, failure analysis, and design handoff.
What we're looking for
- Skills & competencies
- mts hbm architecture & circuit design engineerhbmdram architecturecircuit designrichardson txmicron technology3d-stacked memoryspice simulationtiming closuresilicon bring-upmemory reliabilitycross-functional designmedical dental visionpaid family leave
- Work arrangement
- Weekend coverage required
Benefits & perks
- Medical, dental, and vision plans, income-protection benefits, paid family leave, paid time off, and paid holidays.
Why this role
Designs advanced 3D-stacked HBM core-die architecture and critical DRAM circuits.
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.
Additional details
- Industry sector
- 33
- Industry
- Semiconductor and Related Device Manufacturing
- Occupation code
- 17-2072.00
You'll be redirected to the employer's application page.
Listing ID: 772e7fd1-147c-4249-aff9-089a031539ba