Process Integration Engineer, Advanced Packaging

Job overview

The Process Integration Engineer, Advanced Packaging role is onsite in Boise, ID; compensation is not specified. The role supports Micron’s Advanced Packaging Technology Development department, which develops packaging technologies for future AI and high-performance computing applications. The engineer develops and integrates advanced package architectures and processes, improves performance and yield, and helps transfer emerging technologies into manufacturing. Cross-functional work on process qualification, materials, design rules, and warpage control helps turn new packaging approaches into production-ready solutions.

What you'll do

• Develop and optimize 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnect technologies
• design and execute experiments to qualify materials, process flows, and design rules
• analyze yield, performance, and defect data
• support technology transfer and manufacturing readiness
• model and mitigate wafer/die warpage
• collaborate across engineering and manufacturing teams.

What we're looking for

Skills & competencies

boise id

process integration engineer

advanced packaging

2.5d integration

3d stacking

hbm

hybrid bonding

advanced interconnects

yield improvement

warpage engineering

micron technology

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plan choices
• income-protection programs
• paid family leave
• paid time off
• and paid holidays.

Why this role

Focuses on advanced packaging architectures including 2.5D, 3D stacking, HBM, and hybrid bonding, with warpage engineering responsibilities.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.