Senior Package Layout Engineer, Annapurna Labs

Job overview

The Senior Package Layout Engineer role is an onsite position based in Tempe, AZ. The base salary range is $159,200.00 - $215,300.00 USD annually, and this role supports the Annapurna Labs team in developing machine learning acceleration hardware. This role exists to lead the end-to-end physical design of advanced IC packages for next-generation machine learning and data center ASICs. The engineer owns the package layout from floor planning through tape out.

What you'll do

• Lead the full package layout cycle
• Drive physical design of advanced packaging architectures
• Define and optimize package floorplans
• Perform detailed RDL and substrate routing
• Participate in die-level RDL routing.

What we're looking for

Skills & competencies

full-time

day shift

tempe az

annapurna labs

package layout

physical design

asic

machine learning

hardware

$159k-$215k/yr

Work arrangement

• Weekend coverage required

Benefits & perks

• Health insurance, 401(k) matching, paid time off, parental leave, sign-on payments, RSUs

Why this role

Requires 10+ years of experience in IC package layout and physical design.

About the employer

Annapurna Labs (U.S.) Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.