Principal HBM Architecture & Circuit Design Engineer

Job overview

The Principal HBM Architecture & Circuit Design Engineer role is onsite in Richardson, TX. Compensation is not specified. The role supports Micron’s development of advanced 3D-stacked HBM products and AI-enabled solutions. This engineer owns next-generation HBM core-die architecture and critical DRAM circuit design, guiding architecture definition, feasibility, and reference design development. The work contributes to product bandwidth, power, area, thermal efficiency, and reliability goals through cross-functional design execution and silicon evaluation.

What you'll do

• Own HBM core-die architecture and DRAM circuit design
• drive timing closure and evaluate bandwidth, power, area, thermal, and reliability trade-offs
• define refresh, row-hammer mitigation, data-retention, and power-efficient schemes
• conduct feasibility studies using transistor-level simulation and physical implementation analysis
• develop HBM Architecture Reference Designs
• collaborate with design and verification teams
• support silicon bring-up, characterization, failure analysis, and design handoff.

What we're looking for

Skills & competencies

principal engineer

hbm

dram circuit design

core-die architecture

3d-stacked hbm

spice simulation

architecture reference design

semiconductor

richardson tx

micron technology

onsite

full-time

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plans
• income-protection benefits
• paid family leave
• paid time off
• paid holidays.

Why this role

Advanced 3D-stacked HBM architecture and circuit design; SPICE-based simulation; Architecture Reference Design development.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.