Custom HBM Architecture and Design Engineer
Compensation
$165k – $329k /yr
Employment type
Full-time
Work setting
On-site
Location
Folsom, CA
Schedule
Day shift
Posted
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Job overview
The Custom HBM Architecture and Design Engineer is an onsite role based in Folsom, CA, with a salary range of $165,000 to $329,000 per year. This position supports the Heterogeneous Integration Group at Micron Technology. This role exists to architect and design next-generation HBM SoC logic die. The engineer works on high-performance memory solutions, integrating IP and optimizing power, performance, and area targets.
What you'll do
- Analyze system-level interactions, design RTL for SoC blocks, integrate IP, optimize memory subsystems, and support pre/post-silicon validation.
What we're looking for
- Skills & competencies
- full-timeday shiftfolsom caengineeringarchitecturehbmsemiconductormicron$165k-$329k
- Work arrangement
- Weekend coverage required
Benefits & perks
- Competitive salary, medical, dental, vision, and paid time off.
Why this role
Senior technical role in a world-leading memory and storage innovation company.
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.
Additional details
- Industry sector
- 54
- Industry
- Engineering Services
- Occupation code
- 17-2061.00
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Listing ID: 68aa70a8-aa38-4cf2-bd2d-5c818c290dc6