Intern - Wafer Bonding Process Development
Employment type
Full-time
Work setting
On-site
Location
Boise, ID
Schedule
Day shift
Posted
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Job overview
The Intern - Wafer Bonding Process Development role is an onsite position based in Boise, ID. Compensation is not specified for this internship, which supports the Technology Development organization at Micron Technology, Inc. by advancing semiconductor memory and storage solutions. This role exists to contribute to the research, development, and optimization of advanced wafer bonding technologies. The intern will design and execute experiments, evaluate new process solutions, and analyze data to improve manufacturability and performance in a modern R&D environment.
What you'll do
- Support research and development of wafer bonding technologies
- plan, execute, and analyze experiments
- identify process improvements for yield and quality
- evaluate new equipment and materials
- leverage AI tools for productivity.
What we're looking for
- Skills & competencies
- full-timeday shiftboise idmicron technologyinternshipsemiconductorr&dwafer bondingai toolsno degree required
- Work arrangement
- Weekend coverage required
Benefits & perks
- Medical, dental, and vision plans
- paid family leave
- paid time-off program
- paid holidays.
Why this role
Focus on next-generation semiconductor wafer bonding and AI-assisted R&D workflows.
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Computer Systems Design Services. Sector: 54.
Additional details
- Industry sector
- 54
- Industry
- Computer Systems Design Services
- Occupation code
- 17-3026.00
You'll be redirected to the employer's application page.
Listing ID: 675588ac-2703-4b58-b04a-e2af1b1efe6a