New College Grad - Product Yield Enhancement Engineer, HBM
Employment type
Full-time
Work setting
On-site
Location
Boise, ID
Schedule
Day shift
Posted
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Job overview
The New College Grad - Product Yield Enhancement Engineer, HBM is an onsite role based in Boise, ID. Compensation is not specified for this position, which supports the High Bandwidth Memory (HBM) product team. This role exists to improve product reliability and accelerate production ramp through advanced failure analysis. It contributes to the company's goals by identifying root causes of yield loss and driving resolution for next-generation memory products.
What you'll do
- Perform electrical failure analysis and fault isolation.
- Analyze and model failure signatures.
- Apply physical failure analysis techniques.
- Generate failure analysis reports.
- Collaborate with multi-functional teams to drive resolution.
What we're looking for
- Skills & competencies
- full-timeday shiftboise idmicronnew gradhbmyield enhancementfailure analysissemiconductoronsite
- Work arrangement
- Weekend coverage required
Benefits & perks
- Medical, dental, and vision plans
- paid family leave
- paid time-off
- paid holidays.
Why this role
Focus on HBM yield enhancement and failure analysis for new graduates.
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.
Additional details
- Industry sector
- 33
- Industry
- Semiconductor and Related Device Manufacturing
- Occupation code
- 17-2131.00
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Listing ID: 60f5b57d-a2aa-461d-b11c-a45af2298fc4