Associate or Senior Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth

Job overview

The Associate or Senior Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory) is an onsite role based in Boise, ID. Compensation is not specified. This position supports the HBM Product Development Failure Analysis team at Micron Technology, Inc. This role focuses on bringing next-generation HBM products from design to mass production. The engineer performs electrical and physical failure analysis to identify root causes and drive corrective actions.

What you'll do

• Perform failure analysis
• identify defect mechanisms
• analyze component-level data
• collaborate with engineering teams
• communicate technical findings
• support production ramp.

What we're looking for

Skills & competencies

full-time

day shift

boise id

failure analysis

hbm

semiconductor

yield enhancement

onsite

micron

engineering

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, vision plans, paid family leave, paid time-off

Why this role

Focus on High Bandwidth Memory (HBM) and advanced failure analysis techniques.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.