Process Engineer, Advanced Packaging Technology Development

Job overview

The Process Engineer, Advanced Packaging Technology Development role is onsite in Boise, ID; compensation is not specified. The position supports Micron’s APTD department, which develops processes and manufacturing capabilities for next-generation semiconductor products. The engineer improves process, equipment, and automation performance to strengthen product quality, reliability, and cost. Through root-cause analysis, pilot-line support, and collaboration with engineering teams, the role helps move technology development toward manufacturing transfer.

What you'll do

• Optimize automation, equipment, and process performance
• develop host, automation, and data systems
• conduct root-cause analysis and failure investigations using FMEA, 8D, SPC, and FDC
• partner with equipment, process development, and integration teams on solutions
• support pilot-line operations and technology transfer to high-volume manufacturing sites.

What we're looking for

Skills & competencies

boise id

process engineer

advanced packaging

semiconductor manufacturing

process optimization

automation

equipment performance

root cause analysis

fmea

spc

technology transfer

micron technology

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plan choices
• income-protection programs
• paid family leave
• paid time off
• and paid holidays.

Why this role

Combines process optimization and failure analysis with support for pilot-line operations and technology transfer.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.