Intern, Advanced Packaging TD

Job overview

The Intern, Advanced Packaging TD role is onsite in Boise, Idaho. Compensation is not specified. The intern supports Micron's Advanced Packaging Technology Development team, which develops interconnect technologies to improve semiconductor performance, reliability, and packaging capabilities. Working with experienced engineers, the intern contributes to process and yield improvement through experiments, data analysis, line monitoring, and structured problem-solving. The role also applies AI and Code Assist to develop agent-based solutions for engineering analysis and process development.

What you'll do

• Lead structured problem-solving activities
• define and analyze Design of Experiments for advanced packaging and interconnect development
• analyze process, line-monitoring, and yield data
• develop monitoring methods and metrics
• present findings and collaborate across teams
• apply AI and Code Assist to develop agent-based solutions for engineering workflows and process monitoring.

What we're looking for

Skills & competencies

advanced packaging intern

process development

semiconductor

hybrid bonding

micro bump technology

through-silicon vias

design of experiments

yield improvement

ai and code assist

boise id

micron

Work arrangement

• Weekend coverage required

Benefits & perks

• Micron describes medical, dental, and vision plans, income-protection programs, paid family leave, paid time off, and paid holidays.

Why this role

For candidates pursuing a master's degree or PhD with expected graduation between Fall 2027 and Summer 2028; includes hands-on advanced packaging and agent-based engineering work.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.