Cloud Hardware Development Engineer, Packaging, Network Product Development

Job overview

The Cloud Hardware Development Engineer, Packaging role is an onsite position based in Cupertino, CA. Compensation is not specified in the posting, and this role supports the Amazon Data Services team in network product development. This role exists to perform design, development, and validation of IC and SOC packages. The engineer will ensure robust packaging solutions for high-speed applications in AWS network interconnects.

What you'll do

• Collaborate with vendors to evaluate new packaging technologies, materials, and assembly processes.
• Develop and automate test plans for package characterization including signal integrity, power integrity, and thermal performance.
• Collaborate with vendors in defining test plans for IC/SOC packages.
• Work with operations teams to improve manufacturing yields.

What we're looking for

Skills & competencies

full-time

cupertino ca

packaging engineering

ic design

soc

hardware engineering

networking

signal integrity

onsite

no on-call

no travel

Work arrangement

• Weekend coverage required

Benefits & perks

• Health insurance, 401(k) matching, paid time off, parental leave, sign-on payments, and RSUs.

Why this role

Focus on IC/SOC packaging for high-speed network hardware.

About the employer

Amazon Data Services, Inc. is hiring for this role. Industry: Computing Infrastructure Providers, Data Processing, Web Hosting, and Related Services. Sector: 51.