Director, Package Design Engineering
Employment type
Full-time
Work setting
On-site
Location
Dallas, TX
Schedule
Day shift
Posted
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Job overview
The Director, Package Design Engineering is an onsite role based in Dallas, TX, with compensation not specified. This position supports the Engineering department by overseeing global package development and technology roadmaps. The role exists to lead the design and development of interconnect methods for AI and datacenter power packaging. It contributes to the company's mission of making lives easier through intelligent semiconductor solutions.
What you'll do
- Manage package technology development, oversee global OSAT relationships, define technology roadmaps, manage R&D budgets, and ensure production quality.
What we're looking for
- Skills & competencies
- full-timeday shiftdallas txsemiconductorpackagingengineeringdirectorno on-callno travelleadership
- Work arrangement
- Weekend coverage required
Benefits & perks
- Competitive benefits package
Why this role
Requires 15-20 years of relevant experience.
About the employer
Renesas is hiring for this role. Industry: Engineering Services. Sector: 54.
Additional details
- Industry sector
- 54
- Industry
- Engineering Services
- Occupation code
- 11-9041.00
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Listing ID: 38bd711d-0364-498f-bc6b-32fc312b3662