Director, Technical Package Development

Job overview

The Director, Technical Package Development is an onsite role based in Boise, ID. Compensation is not specified for this position, which supports the DRAM Packaging organization at Micron Technology, Inc. This executive leadership role is responsible for defining the strategy, development, and execution of advanced memory packaging solutions. The director builds and leads a global engineering organization to drive innovation in next-generation packaging architectures, supporting markets such as AI, cloud, and high-performance computing.

What you'll do

• Define and execute long-term DRAM packaging strategies.
• Lead development of advanced packaging technologies including HBM, LPDRAM, DDR, and 3D integration.
• Drive adoption of AI, machine learning, and advanced analytics to improve product development and manufacturing productivity.
• Build and lead a global packaging organization focused on technical excellence and operational execution.
• Partner with design, manufacturing, and supply chain teams to deliver products from concept through high-volume manufacturing.

What we're looking for

Skills & competencies

full-time

day shift

boise id

micron technology

director

semiconductor

packaging

onsite

no on-call

no travel

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plans
• paid family leave
• paid time-off
• paid holidays.

Why this role

Requires 15+ years of semiconductor packaging experience and 10+ years of leadership experience; expertise in HBM, LPDRAM, and 3D stacking.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Computer Systems Design Services. Sector: 54.