Signal and Power Integrity Engineer — Chiplet Packaging

Job overview

The Signal and Power Integrity Engineer — Chiplet Packaging role is onsite; the posting identifies the Bay Area, California, or Burnaby, British Columbia, and says relocation is not available. Compensation is not specified. Eliyan is an early-stage chiplet startup developing chiplet-based systems and packaging solutions. The engineer develops and evaluates packaging solutions for chiplet interconnects through design, simulation, manufacturing, assembly, and testing. The role works with analog circuit designers and layout engineers to optimize signal and power integrity and support high-performance, manufacturable products.

What you'll do

• Define I/O requirements with analog circuit designers
• run pre- and post-layout channel simulations and optimize performance
• use driver and receiver models to inspect eye diagrams
• design power delivery networks and perform DC, AC, and transient simulations
• apply substrate and interposer design rules
• conduct lab measurements, correlate results with simulations, and resolve issues.

What we're looking for

Skills & competencies

signal and power integrity engineer

chiplet packaging

eliyan

onsite

bay area ca

burnaby bc

signal integrity

power integrity

channel simulation

power delivery networks

hfss

q3d

lab measurements

Work arrangement

• Weekend coverage required

Benefits & perks

• The posting describes excellent benefits and a fun work environment.

Why this role

The posting requires onsite work and states that relocation is not available at this time; qualifications include a bachelor's degree in electrical engineering or equivalent and five years of experience.

About the employer

Eliyan is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.