New College Grad - HBM Product Development Failure Analysis Engineer

Job overview

The New College Grad - HBM Product Development Failure Analysis Engineer is an onsite role based in Boise, ID, with compensation not specified. This position focuses on product reliability and component-level failure analysis for High Bandwidth Memory (HBM) products. This role exists to identify and resolve product and process-related issues that impact yield and performance. By using electrical characterization and statistical methodologies, the engineer drives rapid production ramp and ensures high-quality product delivery.

What you'll do

• Perform electrical and physical failure analysis
• analyze characterization data to determine root causes
• collaborate with engineering teams to resolve yield issues
• leverage AI-enabled tools for data analysis
• communicate findings to stakeholders.

What we're looking for

Skills & competencies

full-time

day shift

boise id

micron

engineering

failure analysis

hbm

semiconductor

onsite

new grad

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, vision plans, paid family leave, paid time-off program.

Why this role

Focus on HBM technology; entry-level role for recent graduates.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology). Sector: 54.