Principal Design Engineer — High Bandwidth Memory Architecture

Job overview

The Principal Design Engineer — High Bandwidth Memory Architecture role is onsite in Richardson, TX. Compensation is not specified. The engineer supports Micron’s HBM Architecture team, which develops datapath solutions for next-generation High Bandwidth Memory products. The role architects and optimizes high-speed datapaths across logic and core dies to improve bandwidth, power efficiency, reliability, and scalability. Collaboration with design, PHY, ECC, verification, layout, and system teams helps move designs from concept through silicon bring-up and production.

What you'll do

• Architect and design HBM read and write datapaths across core and logic dies
• develop high-speed, low-latency datapath circuits
• optimize bandwidth, power, area, and timing
• design reliability features including parity, ECC hooks, lane redundancy, and remapping
• translate specifications into micro-architectures
• collaborate with PHY, DFT, verification, and layout teams
• drive schematic- and RTL-level implementations
• contribute to design reviews, documentation, and technical mentoring
• use AI tools to carry out regular work.

What we're looking for

Skills & competencies

principal design engineer

high bandwidth memory

hbm architecture

richardson tx

micron technology

datapath design

logic die

core die

rtl

ecc

high-speed digital design

memory architecture

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plan choices
• income protection benefits
• paid family leave
• paid time off
• paid holidays.

Why this role

Requires a bachelor's degree with seven or more years of relevant industry experience, or a master's degree with five or more years; also requires three or more years in high-speed digital datapath design and two or more years of hands-on schematic, RTL, or mixed-signal datapath implementation.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.