High Bandwidth Memory Design Architect

Job overview

The High Bandwidth Memory Design Architect role is onsite in Richardson, TX; compensation is not specified. The position supports Micron’s Heterogeneous Integration Group HBM Architecture team, which develops next-generation memory solutions for AI, high-performance computing, cloud infrastructure, and advanced networking. The architect analyzes and models future HBM products to inform design tradeoffs and technology pathfinding. By combining simulation, measured data, and cross-functional engineering input, the role develops evidence-based recommendations on performance, power, area, thermal behavior, reliability, and manufacturability.

What you'll do

• Analyze HBM and DRAM architectures using models, simulations, silicon data, and AI-assisted techniques
• develop modeling, simulation, and data-analysis methodologies
• assess architectural alternatives and design sensitivities
• collaborate with architecture, circuit design, layout, packaging, product, and system teams
• perform root-cause analysis using simulation and measured data
• communicate findings, assumptions, risks, and recommendations through presentations, reviews, and documentation.

What we're looking for

Skills & competencies

micron

richardson tx

high bandwidth memory

hbm

design architect

dram

architecture

simulation

modeling

data analysis

power performance area

thermal analysis

semiconductor

onsite

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plans
• income protection benefits
• paid family leave
• paid time off
• paid holidays.

Why this role

Architecture exploration and technology pathfinding for future HBM products, with opportunities to use AI and data-driven engineering methods.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.