Principal Photonics Integration Engineer

Job overview

The Principal Photonics Integration Engineer is an onsite role based in Boise, ID. Compensation is not specified for this position, which supports the Advanced Packaging Technology Development (APTD) team in shaping the future of memory and storage technologies. This role leads the development and integration of silicon photonics and heterogeneous integration technologies. It involves working across multidisciplinary teams to bring new technologies from concept through manufacturing readiness using AI-enabled engineering tools.

What you'll do

• Develop and optimize end-to-end process integration flows for silicon photonics.
• Lead integration and process development for photonic devices and optical interconnects.
• Drive process characterization, DOE execution, and yield improvement.
• Partner with design and manufacturing teams to support tapeouts and technology transfers.
• Lead technical programs and AI-enabled engineering initiatives.

What we're looking for

Skills & competencies

full-time

day shift

boise id

micron

photonics

semiconductor

integration engineering

advanced packaging

r&d

onsite

no on-call

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plans
• paid family leave
• robust paid time-off program
• paid holidays.

Why this role

Requires PhD or equivalent experience in photonics or semiconductor engineering with a focus on silicon photonics integration.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology). Sector: 54.