Design Lead, HBM and Advanced Memory Design

Job overview

The Design Lead, HBM and Advanced Memory Design role is onsite in Richardson, TX; compensation is not specified. The role supports Micron’s development of next-generation HBM and advanced memory products. The lead owns architecture, design, integration, and execution of complex memory subsystems, coordinating across engineering teams to deliver high-quality silicon on schedule. The role also provides technical leadership, guides design decisions, and supports silicon bring-up, debug, characterization, and yield improvement.

What you'll do

• Lead memory subsystem design and top-level integration
• own design planning, technical decisions, risk assessment, and schedule execution
• coordinate with architecture, verification, layout, CAD, product engineering, and technology development
• review specifications and implementation plans
• lead design reviews and issue resolution
• mentor engineers
• improve methodologies using AI-enabled tools and automation
• support silicon bring-up, debug, characterization, and yield improvement.

What we're looking for

Skills & competencies

design lead

richardson tx

micron technology

hbm

advanced memory design

memory subsystems

silicon design

rtl design

design integration

technical leadership

silicon bring-up

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plans
• income protection benefits
• paid family leave
• paid time off
• paid holidays.

Why this role

The posting specifies 20+ years of semiconductor design experience and experience leading complex IC development programs.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Semiconductor and Related Device Manufacturing. Sector: 33.