New College Grad - IC Package Layout Engineer
Employment type
Full-time
Work setting
On-site
Location
Boise, ID
Schedule
Day shift
Posted
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Job overview
The New College Grad - IC Package Layout Engineer is an onsite role based in Boise, ID, with compensation not specified. This position supports the packaging team at Micron Technology, a leader in memory and storage solutions. This role develops IC package layouts for various memory and storage products. The engineer supports feasibility studies, maintains design libraries, and collaborates with cross-functional teams to ensure design quality and manufacturability using advanced CAD and validation tools.
What we're looking for
- Skills & competencies
- full-timeday shiftboise idmicron technologysemiconductoric packaginglayout designcadnew gradonsiteno on-call
- Work arrangement
- Weekend coverage required
Benefits & perks
- Medical, Dental, Vision Plans, Paid Time-Off
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.
Additional details
- Industry sector
- 54
- Industry
- Engineering Services
- Occupation code
- 17-2112.00
You'll be redirected to the employer's application page.
Listing ID: 0d33370b-0f0b-48ac-9fc7-dd59fc7682c0